Software Solutions
Construct
CAD Build-Prep Software
Lattice capabilities, automated build preparation.
Multi-material part design includes:
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Assigning digital materials to multi-body parts
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Geometric operations such as, lattices, skins, material interfaces, blending
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Parametric labeling for part traceability
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Caging to protect parts with delicate features
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Live slicing and part previews
Build preparation:
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Manual arrangement of part positions and orientations
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Automated packing using SSP and Lattice Packing
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Build analysis for material usage, print time estimates
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Build validation checks for collisions, thin features, and bad meshes
Other Software Solutions by Inkbit
Scalable Spectral Packing
Intelligent Packing Software
Inkbit’s Scalable Spectral Packing (SSP) technology can address every stage of the packaging lifecycle.
Whether you need to improve box design, optimize packaging inventory, or enhance robotic fulfillment, SSP integrates seamlessly with your workflows and systems.
Pack Studio™
Packaging Cost Optimization Software
Pack Studio is a next-generation packaging software designed for the manufacturing and logistics industry.
Built on a state-of-the-art algorithmic backbone developed at MIT, Pack Studio enables companies to move from part design to fully cost-optimized packaging concepts in as little as 90 seconds.
Scalable
Spectral Packing (SSP)
How SSP Works
The core of Scalable Spectral Packing (SSP) lies in transforming the traditional 3D packing problem from a geometric to a spectral representation.
By converting spatial data into a spectral format, SSP leverages Fast Fourier Transform (FFT) algorithms and Graphical Processing Unit (GPU) compute hardware for high-speed calculations.
This approach enables the quick analysis and optimization of packing configurations.
Read more about this advanced capability by visiting the MIT article. (SSP, A new computational method facilitates the dense placement of objects inside a rigid container).